Development & Integration of PEEMS for Next Generation Applications

Advanced manufacturing, including integrated printed and flexible electronics, is revolutionizing how industry and Department of Defense (DoD) design, develop, integrate, and manufacture products and weapon systems. U.S. Army Futures Command is strategically and operationally aligned to deliver Future Systems and Concepts. This printed and hybrid technologies utilize advances in materials, process, design, and equipment to capitalize on these new processes and applications. By combining multiple advanced manufacturing technologies together (i.e. Metals, Plastics, Electronics, Energetics, etc.) the DoD is able to fabricate devices and systems previously unachievable. By integrating printed electronics, energetics, materials and sensors into/onto 3D structures, new solutions and applications can be achieved that enhance our military capabilities across the Organic Industry Base.

US Army Combat Capabilities Development Command (DEVCOM) scientists and engineers pushing the state-of-the-art of flexible & printed electronics to ensure that U.S. forces continue to operate from a position of overwhelming technology overmatch. Recent advances in materials printing technologies have allowed revolutionary changes in design, materials, and fabrication of components and sub-systems for numerous military applications. The integration of printed electronics onto/into structures and hybrid devices is shaping how the Army designs, fabricates, integrates, manufactures, and tests their systems. These capabilities are helping the military survive and thrive in multi-domain operations.
Current state-of-the-art and future concepts pertaining to printed technologies within the US Army will be presented. Examples of sensors, power sources, antennas, wearables, prognostic & diagnostic will be discussed. The materials, processes, and equipment that DEVCOM Armaments Center uses to develop and integrate these technologies; along with the challenges associated with testing, qualification, and fielding for commercial and military markets will be discussed.