We will present HERCULES, a first-of-its-kind 3D printed multi-chip module (MCM) built collaboratively with the Department of Defense. HERCULES which employs four digital silicon die interconnected by a fifteen-layer 3D-printed redistribution layer with a minimum feature size of 40 microns and is made using silver nano-particle and polyimide inks, deposited via aerosol jet technology. HERCULES performed equivalently to a traditionally manufactured (wire-bonded) version of the same device and is in the midst of a qualification testing for field deployment. The qualification process investigates failure mechanisms specific to printed electronics, including silver migration and extreme temperature cycling due to processing requirements. We will discuss the benefits of using printed electronics to create MCMs, the steps taken to ensure that printed electronics technologies were suitable for the demands of the application (including RF characterization), the build process for HERCULES, and the extensive ink qualification process used to determine the optimal material set for chip-scale 3D printed electronics solutions.
- Describe a novel printed electronics application
- Identify areas where printed electronics could improve your electronics packaging and sourcing options
- Utilize our ink qualification strategy to optimize their material selections for printed electronics applications