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U3BlYWtlcihFdmVudF8yNDY2MDEyLEV2ZW50UGVvcGxlXzM2NzA3NzE2LFVzZXJfMTY3NjEyMzYp Ryan Schuette Ryan Schuette Ryan Schuette Principal Mechanical Engineer PAR Systems Speaker at RAPID + TCT: Ryan
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UGxhbm5pbmdfMjUyNTc1MA== Ultrasonic Nondestructive Qualification of IN718 Fabricated Using Laser DED Ultrasonic Nondestructive Qualification of IN718 Fabricated Using Laser DED RAPID + TCT
UGxhbm5pbmdfMjUzNjc4MQ== AM Maturation Phase: Focus on Applications and Profitability AM Maturation Phase: Focus on Applications and Profitability RAPID + TCT Session:
U3BlYWtlcihFdmVudF8yNDY2MDEyLEV2ZW50UGVvcGxlXzM2NDY0MzEwLFVzZXJfMTk5NzQxNDUp https://static.swapcard.com/public/images/22b9b30381fb46fab012b2d3351549da.jpeg Chris Holshouser Chris Holshouser
U3BlYWtlcihFdmVudF8yNDY2MDEyLEV2ZW50UGVvcGxlXzM2NDY0Mjg2LFVzZXJfMTk5NzQxNDQp https://static.swapcard.com/public/images/13b3fae5d21a46efab44d7e6b4929fe3.jpeg Katherine Dames Katherine Dames
UGxhbm5pbmdfMjUxODQ1MQ== Additive Manufacturing: Bridging Workforce Challenges Through Innovation Additive Manufacturing: Bridging Workforce Challenges Through Innovation RAPID + TCT Session: In
UGxhbm5pbmdfMjUxODQ1Mw== Co-Printed and Co-Sintered Packaging for Thermal Transfer Devices with LTCC and Copper Co-Printed and Co-Sintered Packaging for Thermal Transfer Devices with LTCC and
UGxhbm5pbmdfMjUxODQ1OA== Virtual Surgical Planning for Osseointegrated Transfemoral Percutaneousimplants Virtual Surgical Planning for Osseointegrated Transfemoral Percutaneousimplants RAPID +