Changda Liu
U3BlYWtlcihFdmVudF8yNDY2MDEyLEV2ZW50UGVvcGxlXzM2NDY0MzM0LFVzZXJfMjI4MTA2MjEp https://static.swapcard.com/public/images/e539742a270c4c959c0ecd7cc7e2f656.png Changda Liu Changda Liu Changda Liu
U3BlYWtlcihFdmVudF8yNDY2MDEyLEV2ZW50UGVvcGxlXzM2NDY0MzM0LFVzZXJfMjI4MTA2MjEp https://static.swapcard.com/public/images/e539742a270c4c959c0ecd7cc7e2f656.png Changda Liu Changda Liu Changda Liu
U3BlYWtlcihFdmVudF8yNDY2MDEyLEV2ZW50UGVvcGxlXzM2NDY0Mjg4LFVzZXJfMjI4MTA2MDQp https://static.swapcard.com/public/images/0a41c2a6275b4ee4ab933618fd33f60b.jpeg Gurjot Dhaliwal Gurjot Dhaliwal Gurjot
UGxhbm5pbmdfMjUxODQ1Ng== A New High Wear-resistant Cemented Carbide Optimized for Laser Powder Bed Fusion A New High Wear-resistant Cemented Carbide Optimized for Laser Powder Bed Fusion RAPID +
U3BlYWtlcihFdmVudF8yNDY2MDEyLEV2ZW50UGVvcGxlXzM2NzA3NzE2LFVzZXJfMTY3NjEyMzYp Ryan Schuette Ryan Schuette Ryan Schuette Principal Mechanical Engineer PAR Systems Speaker at RAPID + TCT: Ryan
UGxhbm5pbmdfMjUyNTc0OQ== Automated Installation of Difficult to Access Fasteners in Aircraft Assemblies Automated Installation of Difficult to Access Fasteners in Aircraft Assemblies RAPID + TCT
UGxhbm5pbmdfMjUyNTc1MA== Ultrasonic Nondestructive Qualification of IN718 Fabricated Using Laser DED Ultrasonic Nondestructive Qualification of IN718 Fabricated Using Laser DED RAPID + TCT
U3BlYWtlcihFdmVudF8yNDY2MDEyLEV2ZW50UGVvcGxlXzM2NDY0MzEwLFVzZXJfMTk5NzQxNDUp https://static.swapcard.com/public/images/22b9b30381fb46fab012b2d3351549da.jpeg Chris Holshouser Chris Holshouser
U3BlYWtlcihFdmVudF8yNDY2MDEyLEV2ZW50UGVvcGxlXzM2NDY0Mjg2LFVzZXJfMTk5NzQxNDQp https://static.swapcard.com/public/images/13b3fae5d21a46efab44d7e6b4929fe3.jpeg Katherine Dames Katherine Dames
UGxhbm5pbmdfMjUxODQ1MQ== Additive Manufacturing: Bridging Workforce Challenges Through Innovation Additive Manufacturing: Bridging Workforce Challenges Through Innovation RAPID + TCT Session: In
UGxhbm5pbmdfMjUxODQ1Mw== Co-Printed and Co-Sintered Packaging for Thermal Transfer Devices with LTCC and Copper Co-Printed and Co-Sintered Packaging for Thermal Transfer Devices with LTCC and