Current electronic printing methods involve depositing a series of conductive tracks and components in a layer wise fashion during the 3D printing process. This two dimensional printing limits the types of curved shapes and embedded features you can build into a 3D printed part. TNO’s SLA technology roadmap introduces true freeform multi-material fabrication, opening the opportunity for printed electronics across layers and along 3D contours.
- Understand current capabilities with electronic 3D printing today.
- Map out current application spaces for this technology.
- Identify what is possible in the next five years and the barriers that need to be overcome.