There is growing need to adopt additive technologies to produce RF/microwave electronics. This trend is motivated by the need for rapid prototyping and the production of RF systems that are flexible, lightweight, conformable and wearable. Printing RF electronics for DoD applications (e.g., radars, communication systems) is challenging since the requisite materials, components and systems demand higher performance than required for low frequency applications.
This talk will describe several printed devices and subsystems, including tunable frequency selective surfaces, phased arrays, printed phase shifters, and printed varactors. Ink development, hybrid chip integration, printed interconnects, and additive microelectronic packaging are key elements of this research. Multi-physics based design and modeling, printing technologies and process development, formulation of the desired materials, and characterization of both the materials and devices encompass the key challenges in applying additive manufacturing, mainly printed electronics, to RF and microwave devices. Details of these challenges and ways of mitigating them through specific applications, which exemplify all stages of development, will be presented. Details of a novel ferroelectric ink, tunable substrates, printed interconnects, and novel ink characterization methods, the key enablers for these applications and devices, will be described.
- Understand the challenges as well as the many advantages provided by additive manufacturing for RF and MW devices
- Be exposed to novel developments including a novel ferroelectric inks, printed varactors and printed as enablers for phased arrays and filters